Dec 30, 2015 | By Kira

Israel-based Nano Dimension has had one success after another this year, and it seems as though they wanted to fit one more big announcement in before 2015 finally comes to a close. Today, the developer of 3D printing electronics systems and nanoparticle 3D printing inks announced that it has filed a patent application with the US Patent and Trademark Office for a new method of 3D printing multimaterial objects, including electrical conductors and other 3D objects with conductive traces.

The ability to create functional electronics straight out of a 3D printer opens up 3D printing technologies to a wide range of fields, including consumer electronics and even military applications. Items ranging from smartphones to missiles require careful, controlled processes to fabricate individual materials, however a precise multimaterial 3D printing process capable of embedding connectors directly onto electronic circuits could eliminate the need for assembling sensitive parts separately, saving manufacturers time and money, while allowing them to create complex electronic circuits at the push of a button.

Nano Dimension’s patent-pending process for multimaterial 3D printing involves the sintering of a printed metal conductor within a 3D printed polymer, which allows for complex connectors to be 3D printed, and which makes it possible to 3D print molded connectors directly onto the electronic circuits. According to the company, the process can also be applied to 3D printing non-flat electronic circuits as well as structural objects with embedded electronic circuits. Thanks to this capability, Nano Dimension believes their new breakthrough will enable the creation of freeform electronic products that are not possible using current circuit manufacturing technologies.

This latest patent application is the latest in a string of technological advancements for Nano Dimension, who in the past few months alone has also filed a patent for a new oxidation-resistant conductive copper ink, and launched a brand new line of silver nanoparticle inks called AgCite, both of which enable the 3D printing of functional electronic devices. Of course, both of these outstanding conductive 3D printing inks are part and parcel with Nano Dimensions plans to revolutionize electronic 3D printing through their highly anticipated DragonFly 2020, the first inkjet 3D printed dedicated to printing multi-layer PCBs at home.

These important technological advancements have not gone unnoticed by powerful investors. One week ago, Nano Dimension received a grant approval from Israel’s Chief Scientist worth up to $1.3 million to support the development of the DragonFly 2020 PCB 3D printer. That grant followed an initial $10.9 million in financing raised in June, as well as additional investment agreements totaling $2.2 million in November. Clearly, the interest and demand for 3D printing electronics is high, and with this string of successes in 2015, Nano Dimension is poised to lead the way.



Posted in 3D Printer Company



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