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General
Details
Manufacturer
Model
Assembled
Image
Build envelope
(W x D x H mm)
Nozzle diameter
(mm)
Layer thickness
(mm)
Speed
(mm/s)
Positioning precision
Input format
Software
System compatibility
Power supply
Weight
(kg)
Sumpod
Sumpod Mega
Yes
600x600x600
0.40
0.1
-
0.02
-
-
-
-
-
Mcor Technologies
Mcor IRIS
Yes
256x169x150mm
-
0.1
-
12µ
STL, OBJ, VRML
SliceIT, ColourIT
64 bit Windows XP, Windows Vista, or Windows 7
350W, 240v 50Hz or 120v 60Hz
160
Mcor Technologies
Matrix 300+
Yes
256x169x150mm
-
0.1
-
12µ
STL, OBJ
SliceIT
64 bit Windows XP, Windows Vista, or Windows 7
350W, 240v 50Hz or 120v 60Hz
150
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Build Envelope
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UK 0.1 -,-,-
Countries:
UK
(3)
Manufacturer:
Sumpod
(1)
Mcor Technologies
(2)
Assembled:
Yes
(3)
Technology:
FFF
(1)
SDL
(2)
Nozzle Diameter:
0.40
(1)
-
(2)
Layer Thickness:
0.1
(3)
Speed:
-
(3)
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